THERMAL CONDUCTIVITY of INDIAN UNLEAVENED FLAT BREAD (CHAPATI) AT VARIOUS STAGES of BAKING |
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| Authors: | T.R. GUPTA |
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| Affiliation: | Process Engineering and Plant Design Area Central Food Technological Research Institute Mysore 570 013, India |
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| Abstract: | A steady state technique was used to measure thermal conductivity of whole wheat dough (rolled chapati) and baked chapati (round disc prepared mostly from whole wheat flour dough) at various stages of cooking. Based on the experimental data of chapati at various stages of cooking, a linear equation K = -0.5677 + 0.01396 M + 0.005131 T is proposed for conductivity of wheat flour dough and baked chapati at moisture levels (M): 35 < M < 50 and temperature ranges 35 < T < 60 A separate equation K = 0.3204 + 0.0091 M -0.00805 T predicts thermal conductivity of rolled chapati and baked chapati at T > 60C. |
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