| 无铅钎料开发研究现状 |
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| 引用本文： | 郭康富,康慧,曲平.无铅钎料开发研究现状[J].电子元件与材料,2006,25(2):1-3,7. |
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| 作者姓名： | 郭康富 康慧 曲平 |
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| 作者单位： | 北京航空航天大学机械工程及自动化学院,北京,100083;北京航空航天大学机械工程及自动化学院,北京,100083;北京航空航天大学机械工程及自动化学院,北京,100083 |
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| 摘 要： | 综述了国内外无铅钎料开发的新进展和部分钎料的应用情况,重点介绍了合金元素对Sn-Zn和Sn-Ag两种合金系的性能影响。结合目前的研究成果,详细介绍了无铅钎料开发的现状及前景。
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| 关 键 词： | 金属材料 无铅钎料 综述 润湿性 成分 |
| 文章编号： | 1000-2028（2006）02-0001-03 |
| 收稿时间： | 2005-09-29 |
| 修稿时间： | 2005-09-29 |
Current Research and Development of Lead-free Solder |
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| GUO Kang-fu,KANG Hui,QU Ping.Current Research and Development of Lead-free Solder[J].Electronic Components & Materials,2006,25(2):1-3,7. |
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| Authors: | GUO Kang-fu KANG Hui QU Ping |
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| Affiliation: | School of Mechanical Engineering and Automation, Beijing University of Aeronautics and Astronautics, Beijing 100083, China |
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| Abstract: | Summarised were the recent research and development of lead-free solder and the application of some brazing filler metal in home and abroad. Especially introduced was the influence of trace alloy element on properties of the Sn-Ag and Sn-Zn based solder. In combination of the recent results, the current status and prospect on lead-free solders has been introduced in detail. |
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| Keywords: | metal materials lead-free solder review wettability composition |
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