| 铝键合丝弧高、跨度与可靠性的研究 |
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| 引用本文： | 杨建军.铝键合丝弧高、跨度与可靠性的研究[J].电子测试,2022(2):100-103. |
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| 作者姓名： | 杨建军 |
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| 作者单位： | 中国电子科技集团公司第十三研究所,河北石家庄,050051 |
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| 摘 要： | 铝丝键合作为一项半导体产品的封装工艺，被广泛用于连接半导体器件内具有铝焊盘4的芯片与其它元件。然而，如果产品内铝丝连接设计或者键合工艺参数超出铝丝材料承受能力，会降低产品的可靠性。本文以铝丝键合失效案例为起始，设计铝丝键合工艺研究试验，对铝丝所能承受的最高弧度和最大跨度进行了讨论和总结，并提出修改意见。通过对比调整前后产品内铝键合丝拉断力和拉断力标准差，证明修改后该产品可靠性明显得到了提升，也论证本文更改建议的正确性。
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| 关 键 词： | 铝丝 键合 失效 标准差 可靠性 |
Study of the loop hight and span of Al wire and Reliability |
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| Yang Jianjun.Study of the loop hight and span of Al wire and Reliability[J].Electronic Test,2022(2):100-103. |
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| Authors: | Yang Jianjun |
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| Affiliation: | (The 13th Research Institute,China Electronics Technology Group Corporation,Shijiazhuang Hebei,050051) |
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| Abstract: | As a semiconductor packaging technology,Aluminum(Al)wire bounding is widely used to generate the connection between the chip with Aluminum pad and the other elements of the semiconductor device.But the reliability of product will degrade if the connection design or bonding parameters beyond the capability of Al wire.This paper start with a failed case of Al wire bonding,then design experiment to discuss and analyze the loop hight and span of Al wire,at last propose the improving suggestions.The reliability of product has been improved by comparing the wire bonding strength and standard deviations of bonding strength.It also confirmed the correctness of the improving suggestions in this paper. |
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| Keywords: | Aluminum wire bond failure standard deviation reliability |
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