| 一种机载电子设备的热设计仿真与试验研究 |
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| 引用本文： | 贲少愚.一种机载电子设备的热设计仿真与试验研究[J].现代雷达,2015(7):73-75. |
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| 作者姓名： | 贲少愚 |
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| 摘 要： | 介绍一种机载电子设备机箱的热设计,使用IcePak软件对机箱内部空气流动情况进行仿真分析。分析结果表明:当风扇与模块之间的间距达到40 mm以上时,机箱内的流场分布趋于均匀。试验测试验证了仿真结果的正确性,该结论可以作为类似的电子设备机箱热设计的参考。
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Simulation and Experiment about the Thermal Design of an Airborne Electronic Equipment |
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| BEN Shaoyu.Simulation and Experiment about the Thermal Design of an Airborne Electronic Equipment[J].Modern Radar,2015(7):73-75. |
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| Authors: | BEN Shaoyu |
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| Abstract: | The paper introduces a thermal design of an airborne electronic equipment. The simulation analysis of the air flow in the cabinet is done using IcePak. It is shown that when the distance between the fan and the module is over 40 mm, the air flow is proper. The conclusion is proved by experiment. The conclusion can be used as reference in the thermal design of other similar airborne electronic equipment. |
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| Keywords: | electronic equipment thermal design forced-air cooling flow field simulation-based optimization |
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