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Die-attaching silver paste based on a novel solvent for high-power semiconductor devices |
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| Authors: | Jinting Jiu Hao Zhang Shijo Nagao Tohru Sugahara Noriko Kagami Youji Suzuki Yasuyuki Akai Katsuaki Suganuma |
| Affiliation: | 1. The Institute of Scientific and Industrial Research (ISIR), Osaka University, Mihogaoka 8-1, Ibaraki, Osaka, 567-0047, Japan 2. Daicel Corporation, 1239, Shinzaike, Aboshi-ku, Himeji, 671-1283, Japan |
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| 本文献已被 SpringerLink 等数据库收录！ | |