MECHATRONICS 2000. Seventh Mechatronics Forum InternationalConference and Mechatronics Education Workshop

The following topics are dealt with: flip chip solder joint quality inspection; direct chip attach packaging for microsystems; reliability analysis of no-underfill flip chip package; ASIC/memory integration by system-on-package; wafer-level and flip chip designs through solder prediction models and validation; reliability evaluation of under bump metallurgy in two solder systems; a method to improve the efficiency of the CMP process; thermal and reliability analysis of packaging systems