热载流子应力下超薄栅p MOS器件氧化层陷阱电荷的表征

利用电荷泵技术研究了 4nmpMOSFET的热载流子应力下氧化层陷阱电荷的产生行为 .首先 ,对于不同沟道长度下的热载流子退化 ,通过直接的实验证据 ,发现空穴陷阱俘获特性与应力时间呈对数关系 .然后对不同应力电压、不同沟道长度下氧化层陷阱电荷 (包括空穴和电子陷阱俘获 )的产生做了进一步的分析 .发现对于 pMOSFET的热载流子退化 ,氧化层陷阱电荷产生分两步过程 :在较短的应力初期 ,电子陷阱俘获是主要机制 ;而随着应力时间增加 ,空穴陷阱俘获作用逐渐显著 ,最后主导了氧化层陷阱电荷的产生.

Characterization of Oxide Charge During Hot-Carrier Degradation of Ultrathin Gate pMOSFETs--Investigated by Charge Pumping Technique

The generation of oxide charge for 4nm pMOSFETs under hot-carrier stress is investigated by the charge pumping measurements.Firstly,the direct experimental evidences of logarithmic time dependence of hole trapping is observed for pMOSFETs with different channel lengths under hot-carrier stress.Thus,the relationships of oxide charge generation,including electron trapping and hole trapping effects,with different stress voltages and channel lengths are analyzed.It is also found that there is a two-step process in the generation of oxide charge for pMOSFETs.For a short stress time,electron trapping is predominant,whereas for a long stress time,hole trapping dominates the generation of oxide charge.