| 镀铜液中铜的测定 |
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| 引用本文： | 邱林友.镀铜液中铜的测定[J].电镀与涂饰,1998,17(3):41-42. |
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| 作者姓名： | 邱林友 |
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| 作者单位： | 昆明理工大学分析中心!650093 |
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| 摘 要： | 以硫脲掩蔽Ｃｕ，ＥＤＴＡ滴定共存离子，然后用Ｈ２Ｏ２破坏硫脲铜配合物，再以标准ＥＤＴＡ滴定，计算得出铜含量。
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| 关 键 词： | 测定 EDTA 镀铜 电镀 镀液 |
Determination of Copper Content in the Copper Electroplating Solution |
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| Qiu Linyou.Determination of Copper Content in the Copper Electroplating Solution[J].Electroplating & Finishing,1998,17(3):41-42. |
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| Authors: | Qiu Linyou |
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| Abstract: | Copper content in copper plating solution was determinated as the following procedures which cupricions initially masked with thiourea and subsequently titrated by EDTA, then thiourea-copper complexant decompeosed with the addition of H2O2, finally copper content calculated by titration of standard EDTA solution. |
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| Keywords: | copper detemination ethylenediamine tetra acetic acid |
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