Transient analysis of dynamic crack propagation in piezoelectric materials |
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Authors: | Xi‐Hong Chen Yi‐Shyong Ing Chien‐Ching Ma |
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Affiliation: | 1. Department of Mechanical Engineering , National Taiwan University , Taipei, Taiwan 106, R.O.C.;2. Department of Aerospace Engineering , Tamkang University , Tamsui, Taiwan 251, R.O.C.;3. Department of Mechanical Engineering , National Taiwan University , Taipei, Taiwan 106, R.O.C. Phone: 886–2–23659996 Fax: 886–2–23659996 E-mail: ccma@ntu.edu.tw |
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Abstract: | Abstract In this paper, the transient analysis of semi‐infinite propagating cracks in piezoelectric materials subjected to dynamic anti‐plane concentrated body force is investigated. The crack surface is assumed to be covered with an infinitesimally thin, perfectly conducting electrode that is grounded. In analyzing this problem, it has characteristic lengths and a direct attempt towards solving this problem by transform and Wiener‐Hopf techniques (Noble, 1958) is not applicable. In order to solve this problem, a new fundamental solution for propagating cracks in piezoelectric materials is first established and the transient response of the propagating crack is obtained by superposition of the fundamental solution in the Laplace transform domain. The fundamental solution to be used is the responses of applying exponentially distributed traction in the Laplace transform domain on the propagating crack surface. Taking into account the quasi‐static approximation, exact analytical transient solutions for the dynamic stress intensity factor and the dynamic electric displacement intensity factor are obtained by using the Cagniard‐de Hoop method (Cagnard, 1939; de Hoop, 1960) of Laplace inversion and are expressed in explicit forms. Numerical calculations of dynamic intensity factors are evaluated and the results are discussed in detail. The transient solutions for stationary cracks have been shown to approach the corresponding static values after the shear wave of the piezoelectric material has passed the crack tip. |
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Keywords: | electrode boundary crack propagation piezoelectric material superposition dynamic stress intensity factor dynamic electric displacement intensity factor |
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