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AlGaN/GaN异质结构欧姆接触的研制
引用本文:焦刚,曹春海,薛舫时,杨立杰,王泉慧,王柏年,金龙,张卫红,沈波,周玉刚,郑有炓.AlGaN/GaN异质结构欧姆接触的研制[J].固体电子学研究与进展,2004,24(1):142-144.
作者姓名:焦刚  曹春海  薛舫时  杨立杰  王泉慧  王柏年  金龙  张卫红  沈波  周玉刚  郑有炓
作者单位:南京电子器件研究所,南京,210016;南京大学物理系,南京,210093
摘    要:研究了 Ga N高温宽禁带半导体外延层上欧姆接触的制备工艺 ,讨论了几种测试方法的优缺点 ,并根据器件制作的工艺兼容性 ,在 n-Ga N样品上获得了 4× 1 0 - 6 Ω·cm2的欧姆接触 ,在 Al Ga N/Ga N异质结构样品上获得了 4× 1 0 - 4Ω· cm2 的欧姆接触。实验结果表明 ,Al Ga N/Ga N上低阻欧姆接触的制备及其工艺兼容性是Ga N HFET器件研制的技术难点

关 键 词:氮化镓  欧姆接触  工艺兼容性
文章编号:1000-3819(2004)01-142-03
修稿时间:2001年12月27

Design and Fabrication of Ohmic Contact on AlGaN/GaN Heterostructure
JIAO Gang,CAO Chunhai,XUE Fangshi,YANG Lijie,WANG Quanhui,WANG Bonian,JIN Long,ZHANG Weihong.Design and Fabrication of Ohmic Contact on AlGaN/GaN Heterostructure[J].Research & Progress of Solid State Electronics,2004,24(1):142-144.
Authors:JIAO Gang  CAO Chunhai  XUE Fangshi  YANG Lijie  WANG Quanhui  WANG Bonian  JIN Long  ZHANG Weihong
Abstract:This paper reports the fabrication technique of ohmic contact on GaN and discusses the relative merits for different testing methods. By using the technique compatible with devices fabrication, the specific contact resistance has been achieved to 4×10 -6 Ω·cm 2 on n-type GaN, and to 4×10 -4 Ω·cm 2 on AlGaN/GaN heterostructure. The experimental results indicate that the fabrications of low ohmic contact resistance on AlGaN/GaN and the technique compatibility are the technical difficulties for the GaN heterostructure field effect transistor(HFET).
Keywords:gallium nitride  ohmic contacts  technique compatibility
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