Thermal coupling in integrated circuits: application to thermaltesting |
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Authors: | Altet J Rubio A Schaub E Dilhaire S Claeys W |
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Affiliation: | Dept. of Electron. Eng., Polytech. Univ. of Catalonia, Barcelona; |
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Abstract: | The power dissipated by the devices of a circuit can be construed as a signature of the circuit's performance and state. Without disturbing the circuit operation, this power consumption can be monitored by temperature measurements of the silicon die surface via built-in differential temperature sensors. In this paper, dynamic and spatial thermal behavioral characterization of VLSI MOS devices is presented using laser thermoreflectance measurements and on-chip differential temperature sensing circuits. A discussion of the application of built-in differential temperature measurements as an IC test strategy is also presented |
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