| 酸性镀铜添加剂研究进展 |
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| 引用本文： | 高泉涌,赵国鹏,胡耀红. 酸性镀铜添加剂研究进展[J]. 电镀与涂饰, 2010, 29(1): 26-29 |
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| 作者姓名： | 高泉涌 赵国鹏 胡耀红 |
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| 作者单位： | 广州市二轻工业科学技术研究所,广东,广州,510663;广州市二轻工业科学技术研究所,广东,广州,510663;广州市二轻工业科学技术研究所,广东,广州,510663 |
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| 摘 要： | 综述了酸性镀铜添加剂的分类、作用机理及其应用,概括了酸性镀铜添加剂的研究现状,并进行了展望。
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| 关 键 词： | 酸性镀铜 添加剂 作用机理 分类 应用 |
Research progress on acidic copper plating additives |
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| GAO Quan-yong,ZHAO Guo-peng,HU Yao-hong. Research progress on acidic copper plating additives[J]. Electroplating & Finishing, 2010, 29(1): 26-29 |
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| Authors: | GAO Quan-yong ZHAO Guo-peng HU Yao-hong |
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| Affiliation: | GAO Quan-yong,ZHAO Guo-peng,HU Yao-hong Guangzhou Etsing Plating Research Institute,Guangzhou 510663,China |
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| Abstract: | The classification,mechanism and application of acidic copper plating additives were reviewed. The research status of acidic copper plating additives was summarized and the prospect was forecasted. |
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| Keywords: | acidic copper plating additive mechanism classification application |
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