| 桥式电路塑封模设计 |
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| 引用本文： | 严智勇. 桥式电路塑封模设计[J]. 模具工业, 2004, 0(3): 37-39 |
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| 作者姓名： | 严智勇 |
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| 作者单位： | 铜陵三佳山田科技有限公司,安徽铜陵,244000 |
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| 摘 要： | 通过分析桥式电路元件KBU的外部形状及封装工艺特点和难点 ,介绍了KBU塑封模的结构、设计要点和模具的工作过程。
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| 关 键 词： | 桥式电路 KBU 封装 塑封模 |
| 文章编号： | 1001-2168(2003)11-0037-03 |
| 修稿时间： | 2003-05-12 |
Design of the Mould for Encapsulating the Bridge Circuits |
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| YAN Zhi-yong. Design of the Mould for Encapsulating the Bridge Circuits[J]. Die & Mould Industry, 2004, 0(3): 37-39 |
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| Authors: | YAN Zhi-yong |
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| Abstract: | Through the analysis of the shape of the bridge circuit component KBU and the characteristics and difficulties of the encapsulating process,the structure of the mould for encapsuˉlating KBU is introduced.The main points for designing the mould and the working process of the mould are stated. |
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| Keywords: | bridge circuit KBU encapsulation encapsulating mould |
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