Characteristics of the Sn-Pb eutectic solder bump formed via fluxless laser reflow soldering |
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| Authors: | Jong-Hyun Lee Daejin Park Jong-Tae Moon Yong-Ho Lee Dong-Hyuk Shin Yong-Seog Kim |
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| Affiliation: | (1) Department of Metallurgy and Materials Science, Hong Ik University, Seoul, Korea;(2) Device and Semiconductor Res. Div., Hyundai Electronics Ind., Kyungki-Do, Korea;(3) Department of Metallurgy and Materials Science, Hanyang University, Ansan, Korea |
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| Abstract: | In an attempt to develop a fluxless reflow solder bumping process, the effects of processing variables, which include energy
input rate and time, and the shape of solder disk on the microstructure of the solder/Cu pad interface and the shear strength
of the joints were investigated. It was demonstrated that a proper combination of the variables could lead to the formation
of a spherical solder bump with shear strength comparable to that formed via the conventional reflow soldering process. In
addition, the kinetics of Cu pad dissolution into the solder during laser heating was modeled numerically to elucidate intermetallic
formation mechanism at the solder/Cu pad interface.
Jointly appointed by CAAM at POSTECH |
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| Keywords: | Fluxless soldering laser reflow solder bumping energy input rate solder disk shear strength |
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