R&D Center, Semiconductor Business, SAMSUNG Electronics Co. Ltd., San #24, Nongseo-Lee, Kiheung Eup, Yongin-Si, Kyungki-Do, South Korea
Abstract:
The production of future generation DRAM devices critically requires R&D of process technologies for highly integrable and cost effective processes. Also, in order to support the ever-increasing requirements for high performance operation, the future DRAM products should be equipped with the capabilities of low voltage operation and high speed. This paper presents an overview of process technology for deep sub-micrometer devices such as a 256 Mbit DRAM based upon current research data and giga bit DRAMs.