| 高热膨胀系数缠绕复合材料用环氧树脂基体的研制 |
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| 引用本文： | 朱博,贾晓龙,李刚,杨小平. 高热膨胀系数缠绕复合材料用环氧树脂基体的研制[J]. 玻璃钢/复合材料, 2011, 0(6): 40-46,12 |
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| 作者姓名： | 朱博 贾晓龙 李刚 杨小平 |
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| 作者单位： | 1. 碳纤维及功能高分子教育部重点实验室,北京化工大学,北京 100029
2. 机电工程学院,北京化工大学,北京 100029 |
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| 摘 要： | 本文以具有反应性端基的液体丁腈橡胶(CTBN)和环氧树脂(EP)为主要原料,成功合成了改性环氧树脂(CTBN-EP),同时制备了以复配环氧树脂为基体的光纤用复合材料筒体。傅里叶红外光谱、扫描电镜、透射电镜以及动态机械分析等测试显示,制备的CTBN-EP与环氧树脂具有良好的相容性。实验结果表明,随着CTBN-EP含量的增加,树脂体系的弯曲强度和弯曲模量降低,而冲击强度逐渐增大。当树脂体系中CTBN-EP的质量分数为20%时,复合材料筒体的轴向热膨胀系数与光纤的热膨胀系数最为接近。
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| 关 键 词： | 环氧树脂 液体丁腈橡胶 复合材料筒体 热膨胀系数 |
STUDY ON EPOXY RESIN MATRIX OF COMPOSITE CYLINDER WITH HIGHER COEFFICIENT OF THERMAL EXPANSION |
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| ZHU Bo,JIA Xiao-long,LI Gang,YANG Xiao-ping. STUDY ON EPOXY RESIN MATRIX OF COMPOSITE CYLINDER WITH HIGHER COEFFICIENT OF THERMAL EXPANSION[J]. Fiber Reinforced Plastics/Composites, 2011, 0(6): 40-46,12 |
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| Authors: | ZHU Bo JIA Xiao-long LI Gang YANG Xiao-ping |
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| Affiliation: | 1(1.Key Laboratory of Carbon Fiber and Functional Polymers,Ministry of Education,Beijing University of Chemical Technology,Beijing 100029,China;2.College of Electrical and Mechanical Engineering,Beijing University of Chemical Technology,Beijing 100029,China) |
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| Abstract: | In this paper,the functionized epoxy resin(CTBN-EP)was synthesized with reactive group terminated liquid nitrile-butadiene rubbers and epoxy resin,as well as the composite cylinder for optical fibers was prepared with complex resin matrix.The Fourier transform infrared spectroscopy(FTIR),scanning electron microscopy(SEM),transmission electron microscopy(TEM) and dynamic mechanical analysis(DMA) indicated that the CTBN-EP had good compatibility with the epoxy resin.With the increasing CTBN-EP contents,the flexural strength and flexural modulus of the modified resin system were decreased while the impact strength of the resin was increased.Additionally,the thermal expansion coefficient of the resin system with 20% CTBN-EP was well matched that of the composite cylinder in the axial direction at-45℃. |
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| Keywords: | epoxy resin liquid nitrile-butadiene rubber composite cylinder coefficient of thermal expansion |
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