| SnAgCu体钎料及BGA焊球焊点纳米级力学性能 |
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| 引用本文： | 颜廷亮,孙凤莲,马鑫,王丽凤.SnAgCu体钎料及BGA焊球焊点纳米级力学性能[J].电子元件与材料,2008,27(9). |
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| 作者姓名： | 颜廷亮 孙凤莲 马鑫 王丽凤 |
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| 作者单位： | 1. 哈尔滨理工大学,材料科学与工程学院,黑龙江,哈尔滨,150040
2. 亿铖达工业有限公司,广东,深圳,518101 |
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| 摘 要： | 为了研究低银Sn-0.3Ag-0.7Cu无铅体钎料、BGA焊料小球和BGA焊点的力学行为,基于物理反分析的方法采用纳米压痕仪对其进行实验。从压痕载荷–深度曲线提取出弹性模量、硬度和蠕变速率敏感指数。结果表明:体钎料的杨氏模量和蠕变速率敏感指数大约是BGA焊料小球和BGA焊点的2.5倍,验证了尺寸效应理论。采用纳米压痕仪测出的体钎料维氏硬度(15.101HV)小于显微硬度计的测量结果(20.660HV)。
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| 关 键 词： | 电子技术 电子封装技术 纳米压痕 Sn-0.3Ag-0.7Cu无铅钎料 |
Nano-mechanical properties of SnAgCu bulk solder and BGA solder ball and solder joint |
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| YAN Ting-liang,SUN Feng-lian,MA Xin,WANG Li-feng.Nano-mechanical properties of SnAgCu bulk solder and BGA solder ball and solder joint[J].Electronic Components & Materials,2008,27(9). |
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| Authors: | YAN Ting-liang SUN Feng-lian MA Xin WANG Li-feng |
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| Affiliation: | YAN Ting-liang1,SUN Feng-lian1,MA Xin2,WANG Li-feng1 (1. School of Material Science & Engineering,Harbin University of Science , Technology,Harbin 150040,China,2. Yik Shing Tat Industrial Co.,Ltd,Shenzhen 518101,Guangdong Province,China) |
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| Abstract: | Nanoindentation apparatus with physics anti analysis method were performed on the Sn-0.3Ag-0.7Cu bulk solder, BGA solder ball and BGA solder joint in order to measure their mechanical behavior. The Young’s modulus, the hardness and the creep rate sensitivity exponent of them were obtained from indentation load-depth curves. The result indicates that the Young’s modulus and the creep rate sensitivity exponent of bulk solder is 2.5 times that of the BGA solder ball and BGA solder joint approximately. The Vickers hardness value (15.101 HV) measured by the nanoindentation apparatus is smaller than that of the test value (20.660 HV) measured by the microhardness meter. |
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| Keywords: | electron technology electronic packaging technology nanoindentation Sn-0 3Ag-0 7Cu lead-free solder |
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