Thermal conductivity of unidirectionally oriented Si3N4w/Si3N4 composites |
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| Authors: | S. W. Lee H. B. Chae D. S. Park Y. H. Choa K. Niihara B. J. Hockey |
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| Affiliation: | (1) Department of Materials Engineering, Sun Moon University, Asan, 336-840, South Korea;(2) Department of Physics, Sunchunhyang University, Asan, 336-840, South Korea;(3) Korea Institute of Machinery and Materials, Changwon, 641-010, South Korea;(4) ISIR, Osaka University, Osaka, 567-0047, Japan;(5) National Institute of Standards and Technology, Gaithersburg, MD, 20899, U.S.A. |
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| Abstract: |  -silicon nitride whiskers were aligned unidirectionally in silicon nitride sintered with 2 wt% Al2O3 and 6 wt% Y2O3. It was be densified by the Gas Pressure Sintering (GPS) method. Thermal conductivity of the sintered body with different amount of - silicon nitride whiskers was measured by the direct contact method from 298 K to 373 K. This unidirectionally oriented -silicon nitride whiskers grew into the large elongated grains, and improved also the thermal conductivity. The amount of -silicon nitride whiskers changed the microstrcuture, which changed the thermal conductivity. |
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