| 半导体材料加工过程的化学方法应用 |
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| 引用本文： | 刘玉岭,张伟才,武永超. 半导体材料加工过程的化学方法应用[J]. 电子工业专用设备, 2009, 38(11): 32-34,45 |
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| 作者姓名： | 刘玉岭 张伟才 武永超 |
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| 作者单位： | 中国电子科技集团公司第四十六研究所,天津,300220;中国电子科技集团公司第四十六研究所,天津,300220;中国电子科技集团公司第四十六研究所,天津,300220 |
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| 摘 要： | 在半导体材料的加工过程中，很多重要步骤都涉及到了化学作用，讨论了半导体材料加工过程中化学缓蚀、化学机械抛光和清洗步骤的化学作用原理，介绍了从化学角度分析和优化半导体加工工艺的观点。
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| 关 键 词： | 半导体材料 缓蚀 化学机械抛光 清洗 |
The Application of Chemical Methods in Semiconductor Materials Processing |
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| ZHANG Weicai,WU Yongchao,LIU Yuling. The Application of Chemical Methods in Semiconductor Materials Processing[J]. Equipment for Electronic Products Marufacturing, 2009, 38(11): 32-34,45 |
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| Authors: | ZHANG Weicai WU Yongchao LIU Yuling |
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| Affiliation: | ZHANG Weicai,WU Yongchao,LIU Yuling(The 46th Research Institute,CETC,Tianjin 300220,China) |
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| Abstract: | There are many important steps have involved the role of the chemical in the processing of semiconductor materials.The chemical theory of corrosion inhibitor in etching, CMP and cleaning were discussed.Ideas to improve process were indroduced from chemical point of view. |
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| Keywords: | Semiconductor materials Corrosion inhibitor CMP Cleaning |
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