| 铜丝球焊中形球过程的数值模拟＊ |
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| 引用本文： | 方鸿渊 钱乙余. 铜丝球焊中形球过程的数值模拟＊[J]. 电子学报, 1993, 21(2): 70-76 |
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| 作者姓名： | 方鸿渊 钱乙余 |
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| 作者单位： | 哈尔滨工业大学，哈尔滨工业大学，哈尔滨工业大学 哈尔滨 150006，哈尔滨 150006，哈尔滨 150006 |
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| 摘 要： | 本文采用数值模拟的方法研究了铜丝球键合技术中的形球过程。通过对超细铜丝在微电弧作用下形球过程中的温度场、速度场和位移场的计算,阐明了铜丝球形成的规律.文中对位移场的计算结果进行了实验验证。
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| 关 键 词： | 铜丝球焊接 温度场 速度 集成电路 |
Numerical Simulation of the Ball Forming Process in Copper Ball Bonding |
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| Fang Hongyuan,Qian Yiyu,Jiang Yihong. Numerical Simulation of the Ball Forming Process in Copper Ball Bonding[J]. Acta Electronica Sinica, 1993, 21(2): 70-76 |
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| Authors: | Fang Hongyuan Qian Yiyu Jiang Yihong |
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| Abstract: | In this paper, the forming process of copper wire ball in copper ball bonding has been studied by numerical simulation. By means of calculation of temperature field, speed field and displacement field for ultrafine copper wire under a mini-arc, the formation rule of copper wire ball has been clarified. The calculating results of displacement field have also been tested and verified. |
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| Keywords: | Forming process of copper wire ball Temperature field Speed field Displacement field |
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