|
|||||
|
|
Through-hole filling characteristics of solderable polymer composites with low melting point alloy fillers |
|
| Authors: | Jeong Il Lee Byung-Seung Yim Mu Seong Yun Jong-Min Kim |
| Affiliation: | 1. School of Mechanical Engineering, Chung-Ang University, Seoul, 156-756, Republic of Korea |
| Abstract: | |
| Keywords: | |
| 本文献已被 SpringerLink 等数据库收录！ | |