| Cu-9.5Ni-2.3Sn-0.5Si合金的固溶处理工艺与组织性能研究 |
| |
| 引用本文： | 刘东辉,;廖钰敏,;邓丽华.Cu-9.5Ni-2.3Sn-0.5Si合金的固溶处理工艺与组织性能研究[J].热处理,2014(4):29-32. |
| |
| 作者姓名： | 刘东辉 ;廖钰敏 ;邓丽华 |
| |
| 作者单位： | [1]赣州逸豪优美科实业有限公司,江西赣州341000; [2]江西理工大学材料科学与工程学院,江西赣州341000 |
| |
| 摘 要： | 采用金相显微镜、扫描电镜、EDAX能谱仪、X射线衍射仪、SIGMASCOPE SMP10型导电仪、维氏硬度计等,研究了热处理工艺对Cu-9.5Ni-2.3Sn-0.5Si合金组织和性能的影响。结果表明:Cu-9.5Ni-2.3Sn-0.5Si合金晶粒尺寸随固溶温度升高而长大;随着固溶温度的升高或固溶时间的延长,电导率先降后升,而硬度则下降。此外,合金经850℃×2 h固溶处理后,形成了Ni2Si、Ni31Si12相并占据了γ-(Cu,Ni)3Sn相的形核位置,此时电导率为12.0%IACS,硬度可达152 HV。
|
| 关 键 词： | Cu-9 5Ni-2 3Sn-0 5Si合金 固溶处理 显微组织 电导率 硬度 |
Effect of Solution Treatment on Microstructure and Properties of Cu-9.5Ni-2.3Sn-0.5Si Alloy |
| |
| Affiliation: | LIU Donghui, LIAO Yumin, DENG Lihua( 1. Ganzhou Yihao Umicore Industry Co., Ltd., Ganzhou 341000, Jiangxi China; 2. School of Materials Science and Engineering Jiangxi University of Science and Technology, Ganzhou 341000, Jiangxi China) |
| |
| Abstract: | Effect of solution treatment processes on microstructure,conductivity and hardness of Cu-9.5Ni-2.3Sn-0.5Si alloy was investigated by means of OM,SEM,EDS,X-ray diffractometer,SIGMASCOPE SMP10-type conductivity meter,Vickers hardness tester and so on.The results show that the grain size of the alloy increases with the raise of solution temperature,and that as the solution temperature becomes higher or the time at the temperature becomes longer,the conductivity first descends then increases,whereas the hardness decreases for the alloy.Furthermore,after the alloy is solution treated at 850 ℃for 2 h,the phases Ni2Si and Ni31Si12 produce and occupy a position where γ-（Cu,Ni）3 Sn phase will nucleate,the conductivity and hardness being 12.0%IACS and as high as 152 HV respectively. |
| |
| Keywords: | Cu-9 5Ni-2 3Sn-0 5Si alloy solution treatment microstructure conductivity hardness |
| 本文献已被 CNKI 维普 等数据库收录！ |
|
