潜伏性热释放2PZ-PS-co-MAA微胶囊固化剂的制备与性能

以2-苯基咪唑(2PZ)为芯材,苯乙烯-甲基丙烯酸共聚物(PS-co-MAA)为壁材,采用溶剂挥发技术,成功地制备了一种新型潜伏性热释放2PZ-PS-co-MAA微胶囊固化剂。通过红外光谱仪(FT-IR)、热重分析仪(TGA)、扫描电子显微镜(SEM)、粒度分析仪和差示扫描量热仪(DSC)对微胶囊固化剂的化学结构、芯材含量、表面形貌、粒径分布及固化性能等进行了表征。所制备的微胶囊固化剂表面光滑,粒径分布较窄,平均粒径约为15.60μm,壁材厚度约为0.5μm,芯材2PZ含量约为39.19%。由微胶囊固化剂与环氧树脂E-51制备的单组分胶粘剂,具有优良的固化特性和潜伏性能,可在100℃,30 min内实现固化,室温储存期可达32 d以上。

Preparation and Performance of Heat Released 2PZ-PS-co-MAA Microcapsule-Type Latent Curing Agent

A heat released microcapsule-type latent curing agent was successfully prepared by solvent evaporation technique with 2-phenylimidazole(2PZ) as the core material and styrene/methacrylic acid copolymer(PS-co-MAA) as the wall material.The chemical structure,core material content,surface morphology,size distribution and curing characteristics of this microcapsule-type curing agent were characterized by Fourier transform infrared spectrum(FT-IR),thermogravimetric analysis(TGA),scanning electron microscope(SEM),granulometer and differential scanning calorimetry(DSC).The obtained microcapsules have a smooth surface and display a narrow size distribution with the mean size about 15.60 μm,and its wall thickness is about 0.5 μm with core material content about 39.19%.In addition,the one-component adhesive made from the microcapsules and epoxy resin E-51 shows advanced curing characteristics and latent properties.It is found that the E-51/PS-co-MAA microcapsule system can be cured at 100 ℃ in 30 min and its shelf life at room temperature is more than 32 days.