| 高可靠镀Ni／Au工艺及其在微波PTFE电路上的应用 |
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| 引用本文： | 龙继东 程娟南. 高可靠镀Ni／Au工艺及其在微波PTFE电路上的应用[J]. 电子工艺技术, 1998, 19(3): 116-119 |
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| 作者姓名： | 龙继东 程娟南 |
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| 作者单位： | 中国西南电子设备研究所 |
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| 摘 要： | 介绍了高可靠电镀Ｎｉ／Ａｕ工艺在ＰＴＦＥ微波印制电路上的应用，并分析了氨基磺酸盐镀软镍和亚硫酸盐镀软金工艺的影响因素及提高Ｎｉ／Ａｕ镀层之间附着力的措施。通过实验及应用证明了与直接镀金工艺相比，在软基材ＰＴＦＥ敷铜箔板上镀Ｎｉ／Ａｕ工艺能大大提高微波电路的可焊性，高温稳定性和长期可靠性，并且用其所制作的微波器件的高频性能也优于直接镀金工业。
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| 关 键 词： | 电镜 PTFE 微波印制电路 可靠性 |
A High Reliable Ni/Au Plating Process and Its Applications for Microwave PTFE Circuits |
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| Long Jidong Cheng Juannan Xu Bo Qin Yueli Chen Hao. A High Reliable Ni/Au Plating Process and Its Applications for Microwave PTFE Circuits[J]. Electronics Process Technology, 1998, 19(3): 116-119 |
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| Authors: | Long Jidong Cheng Juannan Xu Bo Qin Yueli Chen Hao |
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| Abstract: | The applications of nickel/gold electroplating technology on high reliable polytetrafluoroethylene(PTFE)microwave printed circuits (MPC)has been introduced.Some influential factors on soft nickel sulfamate plating and soft gold sulfite plating process and measures of improving adhesion between the nickel barrier and the gold conductor layer have been analyzed.By means of our experiments and product applications,it has been shown that the Ni/Au plating(NGP)technology for the soft PTFE copper clad laminates can enhance more greatly high temperature stability,wire bondability and long term reliability of microwave circuits than direct gold plating (DGP)process.Moreover,high frequency performance of microwave devices fabricated with NGP process is more excellent than it is with DGP process. |
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| Keywords: | Ni/Au electroplating PTFE Microwave printed circuits Reliability |
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