A chip-on-board packaged bandpass filter using cross-coupled topological optimised hairpin resonators for X-band radar application |
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| Affiliation: | 1. Samsung Electronics, Inc., Suwon, Republic of Korea;2. “Gheorghe Asachi” Technical University, Faculty of Electronics, Telecommunications and Information Technology, Department of Telecommunications, Bd. Carol I, No. 11 A, 700506 Iasi, Romania;3. University Politehnica of Timisoara, Faculty of Electronics and Telecommunications, Department of Telecommunications, V. Parvan 2, 300223 Timisoara, Romania;1. Department of Information Engineering, Guilin University of Aerospace Technology, Guilin 541004, PR China;2. College of Material Science and Engineering, Central South University, Changsha 410083, PR China;3. College of Material Science and Engineering, Guilin University of Electronic Technology, Guilin 541004, PR China;1. Department of Electronics and Electrical Communications Engineering, Cairo University, Giza 12613, Egypt;2. Department of Computer and Systems Engineering, Ain Shams University, Cairo 11517, Egypt;1. Digital Design Group SK Hynix Memory Solutions, San Jose, California 95133, USA;2. Department of Electrical and Computer Engineering, Stony Brook University, Stony Brook, New York 11794, USA;1. Department of Physics and Astronomy, Institute of Applied Physics, Seoul National University, Seoul 151-747, Republic of Korea;2. Department of Polymer Science and Engineering, Inha University, Incheon 402-751, Republic of Korea |
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| Abstract: | Devices that are compact in design and fabrication continue to draw attention for specific applications that require high performance. A compact elliptic bandpass filter using a cross-coupled topological structure with a hairpin resonator optimised for radar applications is presented in this paper. This work presents the design theory and corresponding semiconductor fabrication processes and describes the chip-on-board packaging method in detail. The proposed design of the bandpass filter can not only reduce the size of the device and result in good RF performance, but the accurate semiconductor fabrication process can also ensure high performance further. In addition, the presented chip-on-board packaging method can greatly enhance the reliability and long-term stability of a microwave device, which rarely introduces RF characteristic interference. The simulated, bare-chip measured and final chip-on-board measured results agreed well, which validated the correctness of the proposed approach. |
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| Keywords: | Bandpass filter Reliability GaAs substrate Fabrication Chip-on-board packaging |
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