Improving retention properties by thermal imidization for polyimide-based nonvolatile resistive random access memories |
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| Affiliation: | 1. Department of Electronic Engineering, Feng Chia University, Taichung 407, Taiwan;2. Ph.D. Program of Electrical and Communications Engineering, Feng Chia University, Taichung 407, Taiwan;3. Department of Electronic Engineering, National United University, Miaoli 360, Taiwan;4. Daxin Materials Corporation, Taichung 407, Taiwan;5. Graduate Institute of Nanomedicine, College of Biomedical Engineering, Taipei Medical University, Taipei, Taiwan |
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| Abstract: | In this study, a polyimide (PI) thin film was synthesized as a resistive layer for creating resistive random access memory (ReRAM). The switch between high- and low-resistance states is caused by the formation and dissociation of dipole direction and Schottky barrier. The impact of imidization on memory properties was evaluated in detail by clarifying the transmission mechanism, and reliability properties including retention and endurance were improved using thermal imidization. In addition, the proposed PI-based ReRAM demonstrated superior performance levels compared with those of electrochemical-metallization-based and valence-change-based ReRAMs, including higher RON/ROFF ratio (> 107) and lower operation energy (< 0.16 MV/cm). |
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