| BGA技术与质量控制 |
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| 引用本文： | 鲜飞.BGA技术与质量控制[J].电子与封装,2003,3(5):17-20,12. |
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| 作者姓名： | 鲜飞 |
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| 作者单位： | 烽火通信科技股份有限公司,湖北,武汉,430074 |
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| 摘 要： | BGA是现代组装技术的新概念,它的出现促进SMT(表面贴装技术)与SMD(表面贴装器件)的发展和革新,并将成为高密度、高性能、多功能及高I/O数封装的最佳选择。本文简要介绍了BGA的概念、发展现状、应用情况及一些生产中应用的检测方法等,并讨论了BGA的返修工艺。
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| 关 键 词： | 表面组装技术 焊球阵列封装 检测 X射线 质量控制 返修 |
| 修稿时间： | 2003年4月3日 |
BGA Technology and Quality Control |
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| XIAN Fei.BGA Technology and Quality Control[J].Electronics & Packaging,2003,3(5):17-20,12. |
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| Authors: | XIAN Fei |
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| Abstract: | EGA is a new concept of contemporary assembly technology .BGA has developed and innovated the SMT/SMD since it was appered. It is believed that BGA will be the best choice of the IC with density, high performance, multiple function and high I/Os. This paper simply introduces the things of the BGA concept, development ,application and some test methods in the assembly process of ball grid array packaging component, then describes the rework process for BGA. |
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| Keywords: | SMT EGA Test X-ray Quality control Rework |
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