日立化成的弹性薄基板的最新发展（11）

日立化成开发了应用于超薄多层板的新基板，它是由超薄玻璃纤维与一种新低弹性模量热固性树脂体系组成，用相同树脂体系可以形成许多组合，包括板材（TC—c）、半固化片（TC—P）、涂树脂铜箔（TC—F）、粘接膜（TC—A）。通过使用这些组合，可能形成多种薄多层PCB的种类。特别是使用TC-C和TC—F能够容易地制造弯曲部分和多层部分成为一个整体，就不必使用覆盖层与粘接膜，进而可以制造更是薄的高密度PCB。此外，由于简化了线路加工，使得更薄而且可以弯曲的多层PCB具有更高的可靠性。

Recent Progress of Thin Elastic Substrate Materials from Hitachi Chemical(I)

In the paper, Hitachi Chemical＇s new substrates （Cute series： Composite of Ultimate Thin and Elastic materials） for ultra-thin multi-layer boards consist of ultra-thin glass fabric and a novel low elastic modulus thermosetting resin system. They are composed of various lineups with the same resin system for the first time in the world： metal clad laminate （TC-C）, prepreg （TC-P）, metal clad film （TC-F）, and adhesive resin film （TC-A）. Using these lineups, we can fabricate a variety of thin multi-layer Printed wiring boards （PCBs）. In particular, with new laminate and new metal clad film, you can easily fabricate bendable and multi-layer parts in a unity. Since the cover-layer and the bonding sheet are unnecessaky, you can make thinner, higher density. In addition, they will make the circuit manufacturing process simpler to provide thinner and bendable multi-layer PCBs with higher reliability.