Adsorption of mercaptopropionic acid onto Au(1 1 1): Part II. Effect on copper electrodeposition |
| |
Authors: | Marc Petri Ulrich Memmert |
| |
Affiliation: | a Department of Electrochemistry, University of Ulm, Albert-Einstein-Allee 47, 89069 Ulm, Germany b Atotech Deutschland GmbH, 10507 Berlin, Germany |
| |
Abstract: | Copper deposition in the presence of an organic additive (3-mercaptopropionic acid, MPA) was studied by cyclic voltammetry and in situ scanning tunneling microscopy (STM) and the results are compared to those for additive-free solutions. It is shown that underpotential deposition (upd) of copper onto a fully MPA-covered electrode produces a defect-rich substrate, but the defects are blocked by the dense organic film for bulk deposition, resulting in a low number of nuclei. A grain-refining effect of MPA, however, was found, when Cu deposition was initiated shortly after addition of MPA to the solution, i.e., for a low-coverage MPA adlayer. |
| |
Keywords: | Additives Metal deposition Copper Defects Electroplating Grain-refining Self-assembly SAM Au(1 1 1) |
本文献已被 ScienceDirect 等数据库收录! |
|