| 电子组装用低银无铅焊料的研究进展 |
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| 引用本文： | 赵四勇,张宇鹏. 电子组装用低银无铅焊料的研究进展[J]. 热加工工艺, 2010, 39(1) |
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| 作者姓名： | 赵四勇 张宇鹏 |
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| 作者单位： | 广州有色金属研究院,焊接材料研究所,广东,广州,510651 |
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| 基金项目： | 广东省粤港招标项目，广东省科技厅计划处项目 |
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| 摘 要： | 对目前国内外电子组装用低银无铅焊料最新的研究和应用情况进行了回顾和评述,介绍了低银无铅焊料的现状和其可靠性问题,以及国内外对几种低银无铅焊料进行的研究情况,最后着重分析和展望了低银无铅焊料研究应用的主要发展方向和趋势。
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| 关 键 词： | 无铅焊料 锡银铜 可靠性 金属间化合物 低银 |
Development of Lead-free Solder Materials with Low Ag Content in Electronic Packaging |
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| ZHAO Siyong,ZHANG Yupeng. Development of Lead-free Solder Materials with Low Ag Content in Electronic Packaging[J]. Hot Working Technology, 2010, 39(1) |
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| Authors: | ZHAO Siyong ZHANG Yupeng |
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| Affiliation: | ZHAO Siyong,ZHANG Yupeng(Guangzhou Research Institute of Non-ferrous Metals,Guangzhou 510651,China) |
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| Abstract: | The research advances of low-Ag lead-free solder used in electronic packaging were reviewed and commented.Properties and relability problems of low-Ag solders were introduced and commented.Moreover,the domestic and overseas development of several kinds of low Ag solders were introduced.Finally,the research and application prospects of low Ag solder were introduced. |
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| Keywords: | lead-free solder SnAgCu reliability intermetallics low Ag content |
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