| 从日本专利看PCB基板材料制造技术的新发展之二——PCB基板材料树脂中新型填料的运用 |
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| 引用本文： | 祝大同. 从日本专利看PCB基板材料制造技术的新发展之二——PCB基板材料树脂中新型填料的运用[J]. 印制电路信息, 2003, 0(11): 14-19 |
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| 作者姓名： | 祝大同 |
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| 作者单位： | 北京远创铜箔设备有限公司,100009 |
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| 摘 要： | 本连载文章,以近一两年发表的日本专利为对象,综述了日本PCB基板材料业在制造技术上的新发展。本篇主题是PCB基板材料树脂中的新型填料技术。
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| 关 键 词： | 印制电路板 基板材料 覆铜板 填料 |
New Filler Used in Resin of PCB Substrate Material--The Newest Development of Manufacturing Technology about PCB Substrate According to Japanese Patent ( Ⅱ ) |
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| Zhu Datong. New Filler Used in Resin of PCB Substrate Material--The Newest Development of Manufacturing Technology about PCB Substrate According to Japanese Patent ( Ⅱ )[J]. Printed Circuit Information, 2003, 0(11): 14-19 |
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| Authors: | Zhu Datong |
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| Abstract: | The newest development of manufacturing technology about PCB substrate was reviewed according to Japanese patent in recent two years in the serve paper. The article had summarized mostly new filler used in resin of PCB substrate material. |
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| Keywords: | printed circuit board substrate material copper clad laminate filler |
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