| 陶瓷与金属焊接接头残余热应力研究 |
| |
| 引用本文： | 孙福,李京龙,张赋升. 陶瓷与金属焊接接头残余热应力研究[J]. 焊接, 2006, 0(11): 22-25 |
| |
| 作者姓名： | 孙福 李京龙 张赋升 |
| |
| 作者单位： | 西北工业大学摩擦焊接陕西省重点实验室,西安市,710072;西北工业大学摩擦焊接陕西省重点实验室,西安市,710072;西北工业大学摩擦焊接陕西省重点实验室,西安市,710072 |
| |
| 摘 要： | 陶瓷与金属焊后接头的残余热应力是影响其性能的主要因素.从残余热应力研究方法、研究进展和残余应力对接头性能的影响等方面对目前的研究成果进行了综述,并指出目前研究中存在的主要问题,为进一步的研究提供参考.
|
| 关 键 词： | 热应力 有限元 接头性能 |
| 收稿时间： | 2006-09-15 |
| 修稿时间： | 2006-09-15 |
REVIEW ON RESIDUAL THERMAL STRESS OF CERAMIC BONDED JOINT WITH METAL |
| |
| Sun Fu,Li Jinglong,Zhang Fusheng. REVIEW ON RESIDUAL THERMAL STRESS OF CERAMIC BONDED JOINT WITH METAL[J]. Welding & Joining, 2006, 0(11): 22-25 |
| |
| Authors: | Sun Fu Li Jinglong Zhang Fusheng |
| |
| Affiliation: | Shanxi Key Laboratory of Friction Welding Technologies, NWPU |
| |
| Abstract: | Residual thermal stress plays a major part in performance of joints of ceramic and metal. The method and present status to investigate residual thermal stress as well as infuences to bonded joint of residual thermal stress are introduced. Problem in reseach is presented and it provides the references to the further investigation. |
| |
| Keywords: | thermal stress finite element method property of joints |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
