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空心玻璃微珠填充固体浮力材料的制备及性能研究
引用本文:孟凡明,;王鹏,;李瑞,;谢众,;魏浩,;刘连河.空心玻璃微珠填充固体浮力材料的制备及性能研究[J].中国材料进展,2014(9):608-613.
作者姓名:孟凡明  ;王鹏  ;李瑞  ;谢众  ;魏浩  ;刘连河
作者单位:[1]海军驻葫芦岛431厂军事代表室,辽宁葫芦岛125004; [2]哈尔滨工程大学,黑龙江哈尔滨150001; [3]青岛海洋新材料科技有限公司,山东青岛266101
基金项目:科技部国际科技合作专项项目(2011DFR50770)
摘    要:以双酚A环氧树脂E51为基质原料,甲基四氢苯酐为固化剂,K25空心玻璃微珠为轻质填充物,采用模压成形的方法制备了空心玻璃微珠填充固体浮力材料。研究了玻璃微珠的填充率对体系粘度、浮力材料的密度、抗压强度及耐静水压件能的影响。结果表明,低密度空心微珠的引入,有效降低了固体浮力材料的密度,并且随着玻璃微珠填充量的增大,材料的理论计算密度与实际密度的偏差逐渐变大;浮力材料的单轴压缩强度和耐静水压强度随着空心玻璃微珠填充量的增大而降低,当玻璃微珠填充量超过18%时,材料性能下降幅度增大。

关 键 词:空心玻璃微珠  环氧树脂  固体浮力材料

Research on Preparation and Properties of Solid Buoyancy Materials Filled with Hollow Glass Microspheres
Affiliation:MENG Fanming, WANG Peng , LI Rui , XIE Zhong , WEI Hao, LIU Lianhe (1. Military Representative Office of Naval in 431 Factory, Huludao 125004, China) ( 2. Harbin Engineering University, Harbin 150001 , China) (3. Qingdao Advanced Marine Material Technology Co. , Ltd. , Qingdao 266101, China)
Abstract:Solid buoyancy materials with different content of hollow glass microspheres was synthesized by molded form- ing, with bisphenolepoxy resin E51 as bulk material, methyl tetrahydrophthalic anhydride as the curing agent, hollow glass microspheres named K25 as lightweight filler. The influence of the content of glass microspheres on density, uniaxial com- pressive strength and resistance to hydrostatic pressure of solid buoyancy material was studied. The results showed that the introduction of microspheres with lower density could reduce the density of solid buoyancymaterial effectively. With the in- creasing of hollow glass microsphere content, the deviation between theoretical density and actual density increased, and the uniaxial compressive strength and resistance to hydrostatic pressure of solid buoyancy material decreased. Especially, when the content of hollow glass microsphere exceeded 18% , the decrease amplitude of the uniaxial compressive strength and resistance to hydrostatic pressure increased.
Keywords:hollow glass microspheres  epoxy resin  solid buoyancy materials
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