Microstructural Characterization of Cofired Tungsten-Metallized High-Alumina Electronic Substrates

Microstructural characterization of a high-Al₂O₃ substrate containing cofired thick-film tungsten metallization, with particular emphasis on the metal/ceramic interface, was conducted. The substrate contained tabular Al₂O₃ grains surrounded by a continuous calcium magnesium aluminum silicate glass containing particles of monoclinic ZrO₂ and reduced rutile (TiO_{2- x} ). The metal/ceramic adhesion was caused by mechanical interlocking between the W and Al₂O₃ grains by the glass phase which penetrated the porous W layers during sintering; there was no interfacial reaction or diffusion zone. The mechanical properties of the W metallization did not limit interfacial strength. Heat treatments of the substrate at 1400 K in air and under vacuum resulted in the devitrification of the intergranular glass. The most abundant devitrification product was anorthite (CaAl₂Si₂O₈), accompanied by magnesium aluminate titanate, magnesium aluminate spinel, α-cristobalite (SiO₂), and α-cordierite (Mg₂Al₄Si₅O₁₈). In addition, small rutile particles precipitated within the Al₂O₃ grains.