| 多层陶瓷电容器端电极耐焊接热性能下降原因分析 |
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| 引用本文： | 庄立波,包生祥,汪蓉.多层陶瓷电容器端电极耐焊接热性能下降原因分析[J].理化检验(物理分册),2010(2):97-99. |
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| 作者姓名： | 庄立波 包生祥 汪蓉 |
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| 作者单位： | 电子科技大学电子薄膜与集成器件国家重点实验室;成都宏明电子科大新材料有限公司; |
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| 摘 要： | 针对多层陶瓷电容器端电极耐焊接热性能下降的问题,运用扫描电子显微镜分析了端电极表面锡铅镀层的微观结构,并用其附带的能谱仪对其成分进行了分析,找出了端电极耐焊接热性能下降的原因。结果表明:在对多层陶瓷电容器三层端电极中的底层银端浆进行烧结的过程中,由于烧结工艺控制不合理,导致银层部分出现较多的玻璃料物质溢出,因玻璃料物质不导电,在电镀时就会造成表面镀层的不连续致密,从而使得多层陶瓷电容器端电极的可靠性下降,耐焊接热性能降低。
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| 关 键 词： | 多层陶瓷容器 耐焊接热 锡铅镀层 银端浆 |
Degradation Reasons Analysis on the Resistance to Soldering Heat Performance of Terminal Electrodes of Multilayer Ceramic Capacitors |
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| ZHUANG Li-bo,BAO Sheng-xiang,WANG Rong.Degradation Reasons Analysis on the Resistance to Soldering Heat Performance of Terminal Electrodes of Multilayer Ceramic Capacitors[J].Physical Testing and Chemical Analysis Part A:Physical Testing,2010(2):97-99. |
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| Authors: | ZHUANG Li-bo BAO Sheng-xiang WANG Rong |
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| Affiliation: | 1.State Key Laboratory of Electronic Thin Films and Integrated Devices/a>;University of Electronic Science and Technology/a>;Chengdu 610054/a>;China/a>;2.Chengdu Hongming UESTC New Material Co./a>;Ltd./a>;Chengdu 610058/a>;China |
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| Abstract: | Aimed at the problem of resistance to soldering heat(RSH) performance degradation of terminal electrodes with SnPb surface coating in multilayer ceramic capacitors(MLCC) devices,the microstructure and components of SnPb coating were studied with SEM and its attached EDS,and the RSH performance degradation reasons were found.The results show that during the firing processes of silver termination paste,the remains of glass phase were produced,which resulting in the discontinuous of the surface SnPb coating an... |
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| Keywords: | multilayer ceramic capacitor resistance to soldering heat SnPb coating silver termination paste |
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