| 印制电路板用UV光固化材料 |
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| 引用本文： | 金养智,邓建平. 印制电路板用UV光固化材料[J]. 影像材料, 1998, 0(4) |
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| 作者姓名： | 金养智 邓建平 |
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| 作者单位： | 北京化工大学 |
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| 摘 要： | 介绍了国内外印制电路板工业的现状，同时也提出了用于印制电路板生产的ＵＶ固化材料，如光固油墨、干膜、光成像油墨和电沉积光致抗蚀剂。
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| 关 键 词： | 印制电路板 UV固化 光固油墨 光成像油墨 干膜 |
UV Curing Materials for Printed Circuit Board |
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| Jin Yangzhi Deng Jianping. UV Curing Materials for Printed Circuit Board[J]. Image Materials, 1998, 0(4) |
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| Authors: | Jin Yangzhi Deng Jianping |
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| Affiliation: | Jin Yangzhi Deng Jianping |
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| Abstract: | The present state in printed circuit board industry at home and abroad is introduced.UV curing materials for the production of printed circuit board:photo curing inks,dry films,photoimageable inks and electrodeposition photoresist is also presented. |
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| Keywords: | Printed circuit board UV curing photo curing ink Photoimageable ink Dry film |
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