| Sn-Ag-Cu系无铅焊锡成分的优化研究 |
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| 引用本文： | 许天旱,赵麦群,刘新华.Sn-Ag-Cu系无铅焊锡成分的优化研究[J].电子元件与材料,2004,23(8):14-16,21. |
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| 作者姓名： | 许天旱 赵麦群 刘新华 |
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| 作者单位： | 西安理工大学材料科学与工程学院,陕西,西安,710048;西安理工大学材料科学与工程学院,陕西,西安,710048;西安理工大学材料科学与工程学院,陕西,西安,710048 |
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| 基金项目： | 陕西省自然科学研究项目(2002E111) |
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| 摘 要： | 通过正交实验法对Sn-Ag-Cu系无铅焊锡合金的成分进行了优化研究。用光学显微镜、电导仪、热分析仪等对合金的微观组织、电导率、熔点、铺展性能进行了分析,并与Sn37Pb进行了对比。结果表明,Ag、Cu对Sn-Ag-Cu系焊锡合金的熔点、铺展性和电导率都有影响,当Ag质量分数为3%,Cu为2.8%,焊锡合金具有最佳的综合性能,且与铜基板的扩散层厚度大于Sn37Pb。
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| 关 键 词： | 材料合成与加工艺 无铅焊锡合金 熔点 铺展性 |
| 文章编号： | 1001-2028(2004)08-0014-03 |
Study on the 0ptimal Free-lead Solder Alloy of Sn-Ag-Cu System |
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| XU Tian-han,ZHAO Mai-qun,LIU Xin-hua.Study on the 0ptimal Free-lead Solder Alloy of Sn-Ag-Cu System[J].Electronic Components & Materials,2004,23(8):14-16,21. |
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| Authors: | XU Tian-han ZHAO Mai-qun LIU Xin-hua |
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| Abstract: | The optimal composition of lead-free solder of Sn-Ag-Cu system through orthogonal experiment method were studied.By means of optical microscopy, electrical conductivity measuring device and temperature measuring device, the microstructure, electrical conductivity ,solidus temperature, spreading property of solder were analyzed. In addition to, the thinness of the intermetallic layers of Sn-Ag-Cu with the copper plate are compared with that of Sn37Pb. The results show that Ag、Cu has influence on the solidus temperature, spreading property, electrical conductivity of alloy. The solder shows more favorable combination property as content of Ag is 3% and content of Cu is 2.8%. The thinness of the intermetallic layers of Sn-Ag-Cu with copper plate is thicker than that of Sn37Pb. |
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| Keywords: | synthesizing and processing technics free-lead solder alloy solidus temperature spreading property |
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