| 通孔再流焊技术在SMT和THT混装电路板的应用 |
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| 引用本文： | 杜中一.通孔再流焊技术在SMT和THT混装电路板的应用[J].装备制造技术,2014(12):155-156. |
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| 作者姓名： | 杜中一 |
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| 作者单位： | 大连职业技术学院; |
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| 基金项目： | 大连职业技术学院2014年度科研课题“通孔再流焊技术在SMT和THT混装电路板中的应用研究”课题编号:DZ2014B-18 |
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| 摘 要： | 使用通孔再流焊技术焊接SMT和THT混装电路板即可以提高生产效率又可以节省设备成本。通过试验,我们得到了通孔再流焊技术在材料选择、印刷焊膏工艺、元器件安装及再流焊温区参数设置的方法。
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| 关 键 词： | 通孔再流焊技术 混装电路板 焊接 焊膏 |
Pin Through Hole Reflow Soldering Technology In SMT and THT Mixed Printed Circuit Boards Application |
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| Authors: | DU Zhong-yi |
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| Affiliation: | DU Zhong-yi (Dalian Vocational and Technical College, Liaoning Dalian 116037 ) |
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| Abstract: | Using pin through hole reflow soldering technology to solder SMT and THT mixed printed circuit boards, we can increase productivity and save facility cost.Through experiments, we obtain the methods, including the choice of the materials, the process of soldering paste printing, the method of mounting components and the temperature zone param- eters of reflow soldering. |
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| Keywords: | pin through hole reflow soldering technology mixed printed circuit board solder soldering paste |
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