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Concurrent reaction-bonded joining and densification of additively manufactured silicon carbide by liquid silicon infiltration
Affiliation:1. Institute of Materials, China Academy of Engineering Physics, Jiangyou City 621908, Sichuan, China;2. School of Materials Science and Engineering, Materials Genome Institute, Shanghai University, Shanghai 200444, China;1. Beijing Advanced Innovation Center for Materials Genome Engineering, University of Science and Technology Beijing, Beijing 100083, China;2. Department of Physical Chemistry, University of Science and Technology Beijing, Beijing 100083, China;3. School of Mathematics and Physics, University of Science and Technology Beijing, Beijing 100083, China;1. College of Materials Science and Engineering, Sichuan University, 610064 Chengdu, China;1. College of Electronic Information and Engineering, Hangzhou Dianzi University, Hangzhou, China;2. College of Materials Science and Engineering, Liaocheng University, Liaocheng, China;1. School of Mechanical, Electronic and Control Engineering, Beijing Jiaotong University, Beijing 100044, China;2. State Key Lab of New Ceramics and Fine Processing, School of Materials Science and Engineering, Tsinghua University, Beijing 100084, China;3. School of Mechanical Engineering, Dongguan University of Technology, Dongguan, Guangdong 523808, China;4. School of Energy, Power and Mechanical Engineering, North China Electric Power University, Beijing 102206, China
Abstract:In this study, additive-manufactured silicon carbide preforms were joined and densified by reaction bonding via liquid silicon infiltration. The silicon carbide preforms were first printed by binder jetting additive manufacturing. To demonstrate concurrent joining and densification, two preforms with carbon or parchment papers at the interface were concurrently joined and infiltrated by liquid silicon. Results showed a robust interface with thicknesses ranging from 150 to 500 µm, depending on the paper type and the number of paper layers. High-energy synchrotron X-ray revealed that β-phase silicon carbide was formed inside the interface. Finally, two additively manufactured samples with complicated channel geometry were successfully joined. Energy dispersive spectroscopy of the interface of the channeled samples showed a consistent and robust joining. This concurrent approach of joining and densification enables efficiency improvement of fabricating silicon carbide parts with complicated geometries and widens geometry freedom for additive manufacturing of silicon carbide.
Keywords:Silicon carbide  Joining  Reaction bonding  Additive manufacturing  Binder jetting
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