| 表面安装塑封体吸湿性引起的开裂问题及其对策 |
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| 引用本文： | 李兰侠.表面安装塑封体吸湿性引起的开裂问题及其对策[J].电子与封装,2005,5(10):14-16,5. |
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| 作者姓名： | 李兰侠 |
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| 作者单位： | 江苏中电华威电子股份有限公司,江苏连云港222004 |
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| 摘 要： | 随着SMT 封装技术的发展,表面安装型塑封体由于吸湿性引起的开裂问题越来越突出。本文主要对表面安装型塑封体(如SOP、PLCC、PQFP、PBGA 等)在回流焊时吸湿开裂机理以及相应对策等进行讨论分析。
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| 关 键 词： | 塑封体 SMT 吸湿 开裂 对策 |
| 文章编号： | 1681-1070（2005）10-14-03 |
| 收稿时间： | 2005-05-17 |
| 修稿时间： | 2005-05-17 |
Cracking Phenomenon and Countermeasures of Surface Mount Packages under Specified Reflow Conditions |
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| Li Lan-xia.Cracking Phenomenon and Countermeasures of Surface Mount Packages under Specified Reflow Conditions[J].Electronics & Packaging,2005,5(10):14-16,5. |
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| Authors: | Li Lan-xia |
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| Affiliation: | Huawei Electronics Co. Ltd, Jiangsu Lianyungang 222004 China |
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| Abstract: | With the advent of“surface mount technology”(SMT),the problem of plastic package moisture-induced cracking arises.This paper is mostly studying and analyzing moisture-induced cracking of surface mount packages(SOP,PLCC,PQFP,PBGA etc.)under specified reflow soldering conditions, and put forward some corresponding countermeasures. |
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| Keywords: | S M T |
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