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SiGe-based FETs: buffer issues and device results
Authors:H.-J Herzog, T Hackbarth, G H  ck, M Zeuner,U K  nig
Affiliation:

aDaimlerChrysler AG, Research Center Ulm, P.O. Box 2360, 89231 Ulm, Germany

Abstract:SiGe quantum well structures gain increasing interest in the Si technology. The preparation of a Si channel or a Ge-rich or even a pure Ge channel with a respective two-dimensional carrier gas opens the attractive possibility to fabricate high performance n- or p-type field effect transistors. For both device types, a virtual substrate surface is required which is created by a strain relieved buffer layer grown on a Si standard wafer. The paper reviews various approaches of SiGe buffers including special attempts to reduce the thickness and to improve the quality. N- and p-type modulation-doped field-effect transistors are presented which show comparably good device characteristics and cut-off frequencies in the range of 100–120 GHz.
Keywords:SiGe   Strain relieved buffer   Si/SiGe hetero field-effect transistor
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