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A Robust Novel Technique for SPICE Simulation of ESD Snap-back Characteristics
Authors:JIAO Chao YU Zhiping
Affiliation:Institute of Microelectronics, Tsinghua University, Beijing 100084, China
Abstract:ElectoStatic discharge (ESD), SPICE(Simulation program with integrated circuit emphasis)simulation, Snap-back, Gate-grounded NMOS (GGN-MOS), Gate-coupled NMOS (GCNMOS), Compact model.
Keywords:ElectoStatic discharge (ESD)   SPICE(Simulation program with integrated circuit emphasis)simulation   Snap-back   Gate-grounded NMOS (GGN-MOS)   Gate-coupled NMOS (GCNMOS)   Compact model.
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