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单晶片清洗设备化学药液温度控制系统研制
引用本文:马嘉,吴仪,王锐廷,李文杰. 单晶片清洗设备化学药液温度控制系统研制[J]. 电子工业专用设备, 2013, 0(8): 30-34,70
作者姓名:马嘉  吴仪  王锐廷  李文杰
作者单位:北京七星华创电子股份有限公司IC工艺设备研发中心,北京101312
摘    要:针对300 mm单晶片清洗设备,设计开发了一套化学药液温度控制系统。由于化学药液传输系统具有大惯性、大时滞、非线性的特点,采用Smith预估法设计了一种温度控制算法;并基于可编程计算机控制器(PCC)设计实现了化学药液温度控制系统。介绍了该控制系统的硬件组成和控制算法设计,实验结果表明该温度控制系统能够满足清洗工艺需求。该系统现已成功应用于自主研发的300 mm、65 nm铜互连单片清洗设备。

关 键 词:化学药液传输系统  温度控制  Smith预估法  清洗设备

Temperature Control System Development for Chemical Delivery System of Single Wafer Cleaning Tool
MA Jia,WU Yi,WANG Ruiting,LI Wenjie. Temperature Control System Development for Chemical Delivery System of Single Wafer Cleaning Tool[J]. Equipment for Electronic Products Marufacturing, 2013, 0(8): 30-34,70
Authors:MA Jia  WU Yi  WANG Ruiting  LI Wenjie
Affiliation:(IC Processing R&D Center, Beijing Sevenstar Electronics Co., Ltd., Beijing 101312, China)
Abstract:A chemical temperature control system is developed for a 300 mm single wafer cleaning system. Due to the inertia, long time delay, nonlinear properties of the chemical delivery system, a temperature control method based on Smith prediction algorithm is designed. The control system is implemented based on Programmer Computer Controller (PCC). The hardware system and control algorithm of the control system are introduced in this paper. Experiment results show this system can meet the process requirements. And the system has been applied on 300 mm 65 nm copper-interconnection single wafer cleaning system successfully.
Keywords:Chemical Delivery System  Temperature Control  Smith prediction algorithm  Cleaningequipment
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