Research and application of visual location technology for solder paste printing based on machine vision |
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Authors: | Luosi Wei and Zongxia Jiao |
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Affiliation: | (1) School of Automation Science and Electrical Engineering, Beihang University, Beijing, 100191, China |
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Abstract: | A location system is very important for solder paste printing in the process of surface mount technology (SMT). Using machine
vision technology to complete the location mission is new and very efficient. This paper presents an integrated visual location
system for solder paste printing based on machine vision. The working principle of solder paste printing is introduced and
then the design and implementation of the visual location system are described. In the system, two key techniques are completed
by secondary development based on VisionPro. One is accurate image location solved by the pattern-based location algorithms
of PatMax. The other one is camera calibration that is achieved by image warping technology through the checkerboard plate.
Moreover, the system can provide good performances such as high image locating accuracy with 1/40 sub-pixels, high anti-jamming,
and high-speed location of objects whose appearance is rotated, scaled, and/or stretched. |
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Keywords: | machine vision visual location solder paste printing VisionPro |
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