| N2保护对无铅波峰焊Sn-0．7Cu焊料的润湿性影响及其在焊接工艺中的应用 |
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| 引用本文： | 赵智力,钱乙余,李忠锁.N2保护对无铅波峰焊Sn-0．7Cu焊料的润湿性影响及其在焊接工艺中的应用[J].电子工业专用设备,2004,33(4):29-33. |
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| 作者姓名： | 赵智力 钱乙余 李忠锁 |
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| 作者单位： | [1]哈尔滨工业大学现代焊接生产技术国家重点试验室，黑龙江哈尔滨150001 [2]日东电子发展（深圳）有限公司无铅焊接研发中心，广东深圳，518103 |
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| 摘 要： | 以Sn-0.7Cu焊料、免洗助焊剂为试验材料，采用SAT-5100可焊性测试仪对不同温度不同N2浓度条件下的润湿性进行测试。结果表明，实施N2保护大大改善焊料润湿性，分析润湿机理，阐明N2保护下润湿性改善的原因，指出N2保护的意义还在于拓宽生产工艺窗口，使得工艺参数可在更大范围内调整。
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| 关 键 词： | N2保护焊 润湿性 工艺窗口 润湿机理 无铅波峰焊 Sn-0.7Cu焊料 焊接工艺 电子工业 |
| 文章编号： | 1004-4507(2004)04-0029-05 |
| 修稿时间： | 2004年3月26日 |
Experimental Studies on Wettability of Sn-0.7Cu in Lead-free wave Soldering under
the Protection of Nitrogen and Its Application |
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| ZHAO Zhi-li,QIAN Yi-Yu,LI Zhong-suo.Experimental Studies on Wettability of Sn-0.7Cu in Lead-free wave Soldering under
the Protection of Nitrogen and Its Application[J].Equipment for Electronic Products Marufacturing,2004,33(4):29-33. |
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| Authors: | ZHAO Zhi-li QIAN Yi-Yu LI Zhong-suo |
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| Affiliation: | ZHAO Zhi-li1,QIAN Yi-Yu1,LI Zhong-suo2 |
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| Abstract: | Wetting performance is measured by Solder Checker SAT-5100 under nitrogen atmosphere of different concentration with Sn-0.7Cu solder and no-clean flux .The results showed that wetting performance is improved greatly since the using of Nitrogen. In addition,the article analyses the mechanism of wetting and illustrate the reason that wetting performance is improved in the presence of N2. Besides that function of improving wetting, Utility of N2 can widen the process window and then the process parameter could be adjusted in a larger range? |
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| Keywords: | N2 production: Wetting performance: Process window |
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