黑瓷封装烧结工艺调节

文章介绍了低温玻璃熔封的基本原理，分析了黑瓷封装器件在封装过程中缺陷产生的原因。以日本801型链式烧结炉为例，通过烧结工艺及过程，论述了预烘、烧结气氛、封盖温度、保温时间、升降温速率以及其他因素对黑瓷封装熔封工艺的影响，根据这些影响黑瓷封装熔封工艺的因素进行细化工艺。最后，总结出器件缺陷产生的几种常见形式，并针对性地提出了具体调节黑瓷封装熔封工艺的一些技，亍和方法，以及这些技巧和方法的适用范围，以便掌握黑瓷封盖的基本规律，在以后生产中提高产品可靠性和合格率。

Process Adjustment of the Black Ceramic Packaging Sinter

In this paper, the basic principles of the low-thermo glass sealing are introduced, the factors , that the defect during the black ceramic packaging device produced are analyzed. The instance for the chain sintering roaster made in Japan, 801 type in course of the sintering process,we would discuss the effect which influence the black ceramic packaging sealing process for prepared roast, sintering atmosphere, sealing gland temperature, ascending and descending velocity of temperature etc, and further accura...