Impulse Pressure Assisted Diffusion Bonding of Low Carbon Steel Using Silver Interlayer |
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Authors: | Gaurav Sharma Lokesh Tiwari Dheerendra Kumar Dwivedi |
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Affiliation: | 1.Department of Mechanical and Industrial Engineering,Indian Institute of Technology Roorkee,Uttarakhand,India |
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Abstract: | In the present study, impulse pressure assisted diffusion bonding of low carbon steel was carried out using silver interlayer. To study the influence of input process parameters namely bonding temperature (T), maximum pulse pressure (P), and number of pulses (N), experiments of diffusion bonding were conducted according to the Taguchi L9 orthogonal array. To reveal the typical bond interface characteristics, selected samples were examined by scanning electron microscopy (FESEM) equipped with energy dispersive spectroscopy (EDS). The EDS analysis revealed a diffusion affected zone at the interface due to the diffusion of silver and iron across the interface. Lap joints were developed to measure the shear strength of the diffusion bonds. The optimum level of bonding temperature, maximum pulse pressure and number of pulses (875 °C, 10 MPa and 10 pulses) were identified. The ANOVA results indicated that bonding temperature had the highest statistical effect of 66.37% on shear strength followed by number of pulses and maximum pulse pressure. The fracture surface of the lap joints was also examined by FESEM and X-ray diffraction analysis. |
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