反式聚异戊二烯/纳米碳化硅形状记忆复合材料的制备与性能

以反式聚异戊二烯（TPI）为基质，研究了纳米碳化硅用量对碳化硅/TPI形状记忆复合材料硫化特性、物理机械性能、热性能及形状记忆性能的影响。结果表明，随着碳化硅用量的增加，复合材料的焦烧时间和正硫化时间都逐渐缩短；拉伸强度呈现先增大后减小的趋势，硬度逐渐增大；结晶度逐渐降低，从纯TPI的16.5%下降至碳化硅用量20份（质量，下同）时的13.9%；碳化硅用量为10份时复合材料的单向形状记忆性能最好，而其双向形状记忆行为在应力为250 kPa时的形状回复率达到了最大值79.1%。

Preparation and properties of trans-1,4-polyisoprene/nano silicon carbide shape memory composites

Using trans-polyisoprene （TPI） as matrix, the effects of nano SiC amount on curing characteristics, physical and mechanical properties, thermal properties and shape memory properties of SiC/TPI shape memory composites were studied. The results showed that with increase of SiC amount,the scorch time and curing time of the composites decreased gradually, tensile strength increased firstly and then decreased, and hardness increased gradually. The crystallinity of the composites decreased gradually from 16.5% to 13.9% as SiC amount increased from 0 to 20 phr (mass, the same below). The one-way shape memory property of the composites was the best when the amount of SiC was 10 phr, and the shape recovery rate of the two-way shape memory behavior reached the maximum value of 79.1% when the stress was 250 kPa.