| 大功率LED多芯片模块水冷散热设计 |
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| 引用本文： | 杨传超,王春青,杭春进.大功率LED多芯片模块水冷散热设计[J].电子工艺技术,2010,31(5). |
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| 作者姓名： | 杨传超 王春青 杭春进 |
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| 作者单位： | 哈尔滨工业大学材料科学与工程学院,黑龙江,哈尔滨,150001 |
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| 摘 要： | 针对车用大功率LED照明灯,提出了水冷热沉散热设计.比较了水冷热沉内部串联方式、伪串联方式、并联方式和伪并联方式四种水道的对应LED结温与水泵功率.研究了采用并联方式时LED结温与各条分水道流速的相对标注偏差值(简称RSD值)之间的关系和降低RSD值的方法.计算了经优化设计后的水冷散热系统各个环节的热阻,并与热管自然对流散热进行了比较.
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| 关 键 词： | 热设计 水冷 热阻 |
Water Cooling Design for High Power LED Multi-Chip Module |
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| YANG Chuan-chao,WANG Chun-qing,HANG Chun-jin.Water Cooling Design for High Power LED Multi-Chip Module[J].Electronics Process Technology,2010,31(5). |
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| Authors: | YANG Chuan-chao WANG Chun-qing HANG Chun-jin |
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| Affiliation: | YANG Chuan-chao,WANG Chun-qing,HANG Chun-jin(School of Materials Science & engineering of Harbin Institute of Technology,Harbin 150001,China) |
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| Abstract: | For automobile high-power LED lighting,9W LED multi-chip module and water cooling heat sink models were developed in Icepak.Serial channel,pseudo-serial channel,parallel channel and pseudo-parallel channel were totally compared.The relationship between PN junction temperature and the relative standard deviation(RSD) of speed in each sub-channel has been investigated.Thermal resistance of each part of optimized water cooling system was calculated,and compared with heat pipe nature convention heat dissipating... |
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| Keywords: | LED RSD |
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