| 甲烷磺酸电镀Sn-Pb合金添加剂研究 |
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| 引用本文： | 何华林,吴翘顺.甲烷磺酸电镀Sn-Pb合金添加剂研究[J].电镀与精饰,2002,24(2):13-14,27. |
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| 作者姓名： | 何华林 吴翘顺 |
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| 作者单位： | 成都爱伦精细化学品实业公司,四川,成都,611731 |
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| 摘 要： | 介绍了国内外磺酸型Sn-Pb合金电镀添加剂近十年的研究历程现况并根据各组分的化学结构及其在电镀中所体现出的性质将添加剂分为Sn^2 离子稳定剂、光亮剂及分散剂三类。最后列出了新研制的甲烷磺酸Sn-Pb合金电镀添加剂的主要性能及具体工艺配方。
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| 关 键 词： | 电镀添加剂 甲烷磺酸 电镀 锡铝合金 组分 化学结构 |
| 文章编号： | 1001-3849(2002)02-0013-02 |
An Investigation on Additives in Methanesulfonic Acid Tin-Lead Alloy Electroplating |
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| HE Hua lin,WU Qiao shun.An Investigation on Additives in Methanesulfonic Acid Tin-Lead Alloy Electroplating[J].Plating & Finishing,2002,24(2):13-14,27. |
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| Authors: | HE Hua lin WU Qiao shun |
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| Abstract: | Research status of additives in sulfonic acid tin lead electroplating in recent ten years at home and abroad is introduced. The additives are classified as Sn 2+ stabilizer, brightener and carrier three kinds according to their chemical structure and to the performance they exhibited in electroplating. Main performances of the additives for methanesulfornic acid Sn Pb alloy electroplating developed recently by the company and the technological formulation of the methane sulfonic acid Sn Pb electroplating bath are presented. |
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| Keywords: | Sn Pb alloy electroplating additive methane sulfonic acid |
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